*Single sided, Double sided (FR-4, Getek, Polymide, Teflon, Roger, Nelco...)
*Multilayers up to 24 layers
*Multilayers with Blind, Buried Vias
*Multilayers Hybrids.
*Multilayers for Flash Card and PCMCIA applications (Smart Cards)
(6 layers with finished thickness of 0.018” Max)
*Probe Cards
*COB
*SIMM
*Sequential Lamination
*BGA (Flip Chip)/ SUBSTRATE
*Bluetooth
*Controlled Impedance
(Microstrip, Embedded Microstrip, Stripline, Dual Lines, Differantial...)
*Edge Plating.
*Hole Castilation.

With Surface Finishing including:
*SMOBC, HASL
*Tin Nickel
*Gold Body (Soft or Hard Gold)
*Selective Gold
*Immersion (Gold or Tin)
*Entek OSP
*Carbon Ink
*Omikron (White Tin)