Features and Capabilities:

QualTech Circuits, Inc., has proven the experience producing high quality printed circuit boards using the latest technology, material and manufacturing techniques. Our capabilities shown below are  manufactured on a daily basis. However, our engineering team loves a challenge, and is willing to take that extra step to work with our customers on those creative projects and to assists them on all their printed circuit boards needs.

Materials:
Laminate per IPC-4101

Name of material
Itech IT180
Getek/Megtron
Nelco 4000-13
Polyimide
Teflon
Rogers 4003 and 4350
Pyralux

Multilayers:
Maximum board size:
Maximum layers:
Maximum thickness:
Finished Thickness Tolerances:

Maximum Tg ©
180 (Rohs Compliant)
175 - 185
>180
235
>250
>250
225


23" X 29"
24
0.25"
<0.030" +/- 0.003"
>0.031" +/- 10%
We also manufacture PCBs with tight thickness tolerances.

Inner Layers:
Minimum Core Thickness: 0.003" (Standard: 0.005", 0.008", 0.010", 0.014", 0.018", 0.021", 0.031", 0.036", 0.040", 0.059")
Minimum Dielectric: 0.003" (2 sheets 106 Prepreg) Standard: 0.005" or thicker
Minimum Copper Weight: 0.025" (1/4 oz) Standard: 1oz, 2oz
Prepreg Available: 106 (0.0015"), 1080 (0.0025"), 2313 (0.0035"), 7628 (0.0068")

Technologies:
3 mils Trace and 3 mils Space (Standard: 5 mils Trace and 5 mils Space)
8 mils Smallest Drill Size (Standard: 14.5 mil)
Multilayers with Blind and Buried Vias
Chip on Board
Controlled Impedance (Microstrip, Embedded Microstrip, Stripline, Differential)
Multilayers for Flash Card and PCMCIA applications (Smart Cards)
(8 layers with finished thickness of 0.024 inches Max.)
BGA (Flip Chip)/ Substrate
Bluetooth Cards

Solder Mask/ Legend:
LPI (Liquid Photo Imageable)
Dry Film
Mask Colors: Green, Red, Blue, Black and Clear
Legend Colors: White, Yellow, and Black

Surface Finished:
SMOBC (Solder Mask Over Bare Copper)
White Tin
Bondable Gold
Gold Body (Soft and Hard Gold)
Selective Gold
Tin Immersion
Gold Immersion
Entek OSP
Carbon Ink
Edge Plating

Drilling:

Blind and Buried Vias
Controlled Depth
Minimum Hole size: Standard 0.0145" Smallest, Minimum: 0.008"
Minimum Slot width: 0.025"
Hole Tolerances:             Minimum
          Sizes                                 Standard                      Plated                      Non Plated
          <0.040"                           +/- 0.003"                  +/- 0.002"                 +/- 0.001"
          0.093">size>0.040"         +/- 0.003"                  +/- 0.002"                 +/- 0.002"
          0.250">size>0.093"         +/- 0.005"                  +/- 0.003"                 +/- 0.002"
          >0.250" +/- 0.005"           +/- 0.003"                  +/- 0.003"
Front to Back Alignment: Standard: 0.003" Minimum 0.0015"

Fabrication:
Tolerance on Overall Dimensions: +/- 0.005"
Minimum inside Radius: 0.015"(Standard: 0.05" using 0.093" rout bit)
Minimum Scoring Depth 0.010"(0.031" Finished Thickness, Standard 0.020" for 0.062")
Beveling, In-Board Beveling
Counter-Sink, Counter-Bore
Edge Milling
Hole Castilation

Testing:
100% Electrical Test with Open and Short
Cad Net-List Testing (IPC356D)
Fixtureless Testing (Flying Probe)
TDR Test (For Controlled Impedance)

 

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